HF650P-0.001-01-1112-NA Bergquist Self-Adhesive Hi-Flow 650P Thermal Gap Pad, 1.5W/m·K, 11 x 12in
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| Producent | Bergquist | | Part Number | HF650P-0.001-01-1112-NA (HF650P0001011112NA) |
| Specifications | Self-Adhesive Hi-Flow 650P Thermal Gap Pad, 1.5W/m·K, 11 x 12in |
| Unit Price | 99,96 EUR |
| Minimum Order Quantity | 1 |
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| Description | Dimensions11 x 12in Length11in MaterialHi-Flow 650P Material Trade NameHi-Flow 650P Maximum Operating Temperature+150°C Minimum Operating Temperature-40°C Self-AdhesiveYes Thermal Conductivity1.5W/m·K Thickness0.001in Width12in Product Details Hi-Flow 650P Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules. Thermal Impedance: 0.20°C-in2/W (@25 psi)150°C high temperature reliabilityNatural tack one side for ease of assemblyExceptional thermal performance in an insulated pad Thermally Conductive Insulators (Heatsinks) |
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