130306E35 BUNGARD Bungard 130306E35 Circuit Board Base Material Cu-coating (L x W) 300 mm x 200 mm Hard paper/single-sided/1 x 35 µm Cu
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| Producent | BUNGARD | | Part Number | 130306E35 (130306E35) |
| Specifications | Bungard 130306E35 Circuit Board Base Material Cu-coating (L x W) 300 mm x 200 mm Hard paper/single-sided/1 x 35 µm Cu |
| Unit Price | 10,20 EUR |
| Minimum Order Quantity | 1 |
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| Description | Bungard 130306E35 Circuit Board Base Material Cu-coating (L x W) 300 mm x 200 mm Hard paper/single-sided/1 x 35 µm Cu Technical data Category PCB material Type single sided Photo-coating positive Copper coating (thickness) 35 µm Material Phenolic paper Material thickness 1.5 mm Length 300 mm Width 200 mm Type Cu-coating Content 1 pc(s) Type 130306E35 Highlights & details RoHS compliant Description The original Bungard name represents the excellent quality and reliability of the materials and equipment used in producing circuit boards for prototypes and limited series production. The particular quality requirement in photo coated basis material is based onthe following factors: The basis material conforms all the international standards and approvals, as summarised listed in Norm IPC 4101 A. The photo enamel gives precise detailed reproduction, high contrast and brief processing times. However, particular attention should be drawn to its completely compliant characteristics in relation to processing tolerances. The only requirement is not to have the light exposure too short in order to have 'guaranteed' results. The lacquer coat is abolutely dust-free with straight edges. The photo lacquer is burnt in and artificially aged, which ensures a very long storage time of over 1 year. A label indicates the use by date. When exposing and developing the advanced product quality is always clearly demonstrated by the relative colour changes. To distinguish them better, only original Bungard circuit boards have a special, blue-dyed light-protective film. |
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