US3014 Capital Advanced Technologies UNI-SIP PCB PROTOTYPING BREADBOARD; PITCH SPACING:2.5MM; BOARD MATERIAL:FR4 EPOXY GLASS; BOARD THICKNESS:0.79MM; BODY MATERIAL:FR4 EPOXY GLASS; EXTERN

ProducentCapital Advanced Technologies
Part Number

US3014 (US3014)

Specifications

UNI-SIP PCB PROTOTYPING BREADBOARD; PITCH SPACING:2.5MM; BOARD MATERIAL:FR4 EPOXY GLASS; BOARD THICKNESS:0.79MM; BODY MATERIAL:FR4 EPOXY GLASS; EXTERN

Unit Price4,78 EUR
Minimum Order Quantity1
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