PA0170-S Chip Quik Inc MINI SOIC-8 EXP PAD STENCIL

ProducentChip Quik Inc
Part Number

PA0170-S (PA0170S)

Specifications

MINI SOIC-8 EXP PAD STENCIL

Unit Price10,23 EUR
Minimum Order Quantity1
Tariff No.
Lead Time
Weight and Dimension
DescriptionCategories Soldering, Desoldering, Rework Products Solder Stencils, Templates Manufacturer Chip Quik Inc. Series Proto-Advantage Part Status Active Type Mini SOIC Number of Positions 8 Thickness 0.0040" (0.102mm) Pitch 0.026" (0.65mm) Outer Dimension 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad 0.067" L x 0.315" W (1.70mm x 8.00mm) Material Stainless Steel
Datasheets
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