SMD291SNL60T4 Chip Quik Inc SN96.5/AG3.0/CU0.5 2-PRT MIX 60G Lead Free No-Clean Solder Paste Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) Jar, 15g (0.5 oz)

ProducentChip Quik Inc
Part Number

SMD291SNL60T4 (SMD291SNL60T4)

Specifications

SN96.5/AG3.0/CU0.5 2-PRT MIX 60G Lead Free No-Clean Solder Paste Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) Jar, 15g (0.5 oz)

Unit Price46,81 EUR
Minimum Order Quantity1
Tariff No.
Lead Time28 weeks
Weight and Dimension
DescriptionCategories Soldering, Desoldering, Rework Products Solder Manufacturer Chip Quik Inc. Series - Part Status Active Process Lead Free Type Solder Paste Flux Type No-Clean Composition Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) Wire Gauge - Diameter - Core Size - Form Jar, 15g (0.5 oz) Melting Point 423 ~ 428°F (217 ~ 220°C) Shelf Life 24 Months (Date of Manufacture) (Unmixed)
Datasheets
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