SMD291SNL60T4 Chip Quik Inc SN96.5/AG3.0/CU0.5 2-PRT MIX 60G Lead Free No-Clean Solder Paste Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) Jar, 15g (0.5 oz)
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Producent | Chip Quik Inc | Part Number | SMD291SNL60T4 (SMD291SNL60T4) |
Specifications | SN96.5/AG3.0/CU0.5 2-PRT MIX 60G Lead Free No-Clean Solder Paste Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) Jar, 15g (0.5 oz) |
Unit Price | 46,81 EUR |
Minimum Order Quantity | 1 |
Tariff No. | |
Lead Time | 28 weeks |
Weight and Dimension | |
Description | Categories Soldering, Desoldering, Rework Products Solder Manufacturer Chip Quik Inc. Series - Part Status Active Process Lead Free Type Solder Paste Flux Type No-Clean Composition Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) Wire Gauge - Diameter - Core Size - Form Jar, 15g (0.5 oz) Melting Point 423 ~ 428°F (217 ~ 220°C) Shelf Life 24 Months (Date of Manufacture) (Unmixed) |
Datasheets | |
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