SMDLTLFP500T4C Chip Quik Inc SOLDER PASTE LOW TEMP T4 500G Lead Free No-Clean Solder Paste Sn42Bi57.6Ag0.4 (42/57.6/0.4)

ProducentChip Quik Inc
Part Number

SMDLTLFP500T4C (SMDLTLFP500T4C)

Specifications

SOLDER PASTE LOW TEMP T4 500G Lead Free No-Clean Solder Paste Sn42Bi57.6Ag0.4 (42/57.6/0.4)

Unit Price149,46 EUR
Minimum Order Quantity1
Tariff No.
Lead Time28 weeks
Weight and Dimension
DescriptionCategories Soldering, Desoldering, Rework Products Solder Manufacturer Chip Quik Inc. Series - Part Status Active Process Lead Free Type Solder Paste Flux Type No-Clean Composition Sn42Bi57.6Ag0.4 (42/57.6/0.4) Wire Gauge - Diameter - Core Size - Melting Point 281°F (138°C) Shelf Life 6 Months (Date of Manufacture) (Refrigerated)
Datasheets
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