PA0193 Chip Quik Inc TSSOP-16-EXP-PAD TO DIP-16 SMT

ProducentChip Quik Inc
Part Number

PA0193 (PA0193)

Specifications

TSSOP-16-EXP-PAD TO DIP-16 SMT

Unit Price4,67 EUR
Minimum Order Quantity1
Tariff No.
Lead Time14 weeks
Weight and Dimension
DescriptionCategories Prototyping Products Adapter, Breakout Boards Manufacturer Chip Quik Inc. Series Proto-Advantage Part Status Active Proto Board Type SMD to DIP Package Accepted TSSOP Number of Positions 16 Hole Diameter - Pitch 0.026" (0.65mm) Board Thickness 0.062" (1.57mm) 1/16" Material FR4 Epoxy Glass Size / Dimension 0.700" x 0.800" (17.78mm x 20.32mm)
Datasheets
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