EPC2010 EPC TRANS GAN 200V 12A BUMPED DIE N-Channel 200V 12A (Ta) Surface Mount Die

ProducentEPC
Part Number

EPC2010 (EPC2010)

Specifications

TRANS GAN 200V 12A BUMPED DIE N-Channel 200V 12A (Ta) Surface Mount Die

Unit Price10,68 EUR
Minimum Order Quantity1
Tariff No.
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DescriptionCategories Discrete Semiconductor Products Transistors - FETs, MOSFETs - Single Manufacturer EPC Series eGaN® Packaging Cut Tape (CT) Part Status Discontinued at Digi-Key FET Type N-Channel Technology GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss) 200V Current - Continuous Drain (Id) @ 25°C 12A (Ta) Vgs(th) (Max) @ Id 2.5V @ 3mA Gate Charge (Qg) (Max) @ Vgs 7.5nC @ 5V Input Capacitance (Ciss) (Max) @ Vds 540pF @ 100V FET Feature - Power Dissipation (Max) - Rds On (Max) @ Id, Vgs 25 mOhm @ 6A, 5V Operating Temperature -40°C ~ 125°C (TJ) Mounting Type Surface Mount Supplier Device Package Die Package / Case Die
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