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Parts Database Farnell

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PV2GROMMETPK100 Farnell HEAT SINK, 27X27X25MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:3.3K/W; EXTERNAL WIDTH:27MM; HEIGHT:25MM; HEATSINK MATERIAL:ALUMINIUM; E

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detail

Producent

Part Number

PV2GROMMETPK100 (PV2GROMMETPK100)

Specifications

HEAT SINK, 27X27X25MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:3.3K/W; EXTERNAL WIDTH:27MM; HEIGHT:25MM; HEATSINK MATERIAL:ALUMINIUM; E

Unit Price

23,05 EUR

Minimum Order Quantity

1

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