ECA2AHG471 Farnell Instruments HEAT SINK, 28X28X9MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:9.51C/W; EXTERNAL WIDTH:28MM; HEIGHT:9MM; HEATSINK MATERIAL:ALUMINIUM; E

ProducentFarnell Instruments
Part Number

ECA2AHG471 (ECA2AHG471)

Specifications

HEAT SINK, 28X28X9MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:9.51C/W; EXTERNAL WIDTH:28MM; HEIGHT:9MM; HEATSINK MATERIAL:ALUMINIUM; E

Unit Price5,18 EUR
Minimum Order Quantity1
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