MRS25931K1 Farnell Instruments HEAT SINK, 30X30X6MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:9.96C/W; EXTERNAL WIDTH:30MM; HEIGHT:6MM; HEATSINK MATERIAL:ALUMINIUM; E

ProducentFarnell Instruments
Part Number

MRS25931K1 (MRS25931K1)

Specifications

HEAT SINK, 30X30X6MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:9.96C/W; EXTERNAL WIDTH:30MM; HEIGHT:6MM; HEATSINK MATERIAL:ALUMINIUM; E

Unit Price8,10 EUR
Minimum Order Quantity1
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