MKT1813433065G Farnell Instruments HEAT SINK, 35X35X25MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:2.1K/W; EXTERNAL WIDTH:37.5MM; HEIGHT:32.6MM; HEATSINK MATERIAL:ALUMINIU

ProducentFarnell Instruments
Part Number

MKT1813433065G (MKT1813433065G)

Specifications

HEAT SINK, 35X35X25MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:2.1K/W; EXTERNAL WIDTH:37.5MM; HEIGHT:32.6MM; HEATSINK MATERIAL:ALUMINIU

Unit Price10,92 EUR
Minimum Order Quantity1
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