248FGJSPXB25103M Farnell Instruments HEAT SINK, 45X45X10MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:7.93C/W; EXTERNAL WIDTH:45MM; HEIGHT:10MM; HEATSINK MATERIAL:ALUMINIUM;

ProducentFarnell Instruments
Part Number

248FGJSPXB25103M (248FGJSPXB25103M)

Specifications

HEAT SINK, 45X45X10MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:7.93C/W; EXTERNAL WIDTH:45MM; HEIGHT:10MM; HEATSINK MATERIAL:ALUMINIUM;

Unit Price19,58 EUR
Minimum Order Quantity1
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