231219511801 Farnell Instruments HEAT SINK, MULTIFIN, 0.3C/W; IC / TRANSISTOR PACKAGE / CASE:PGA; THERMAL RESISTANCE:0.3C/W; EXTERNAL WIDTH:100MM; HEIGHT:16MM; HEATSINK MATERIAL:ALU

ProducentFarnell Instruments
Part Number

231219511801 (231219511801)

Specifications

HEAT SINK, MULTIFIN, 0.3C/W; IC / TRANSISTOR PACKAGE / CASE:PGA; THERMAL RESISTANCE:0.3C/W; EXTERNAL WIDTH:100MM; HEIGHT:16MM; HEATSINK MATERIAL:ALU

Unit Price48,15 EUR
Minimum Order Quantity1
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