B72510T300K62 Farnell Instruments HEAT SINK, MULTIFIN, 0.7C/W; IC / TRANSISTOR PACKAGE / CASE:PGA; THERMAL RESISTANCE:0.7C/W; EXTERNAL WIDTH:60MM; HEIGHT:16MM; HEATSINK MATERIAL:ALUM

ProducentFarnell Instruments
Part Number

B72510T300K62 (B72510T300K62)

Specifications

HEAT SINK, MULTIFIN, 0.7C/W; IC / TRANSISTOR PACKAGE / CASE:PGA; THERMAL RESISTANCE:0.7C/W; EXTERNAL WIDTH:60MM; HEIGHT:16MM; HEATSINK MATERIAL:ALUM

Unit Price32,69 EUR
Minimum Order Quantity1
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