RC55Y69K801 Farnell Instruments HEAT SINK, TO-3, 1.2C/W; IC / TRANSISTOR PACKAGE / CASE:TO-3; THERMAL RESISTANCE:1.2C/W; EXTERNAL WIDTH:88MM; HEIGHT:35MM; HEATSINK MATERIAL:ALUMINI

ProducentFarnell Instruments
Part Number

RC55Y69K801 (RC55Y69K801)

Specifications

HEAT SINK, TO-3, 1.2C/W; IC / TRANSISTOR PACKAGE / CASE:TO-3; THERMAL RESISTANCE:1.2C/W; EXTERNAL WIDTH:88MM; HEIGHT:35MM; HEATSINK MATERIAL:ALUMINI

Unit Price28,00 EUR
Minimum Order Quantity1
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