GSA2000 Farnell Instruments HEAT SINK, TO-3, 3.3C/W; IC / TRANSISTOR PACKAGE / CASE:TO-3; THERMAL RESISTANCE:3.3C/W; EXTERNAL WIDTH:65MM; HEIGHT:20MM; HEATSINK MATERIAL:ALUMINIU

ProducentFarnell Instruments
Part Number

GSA2000 (GSA2000)

Specifications

HEAT SINK, TO-3, 3.3C/W; IC / TRANSISTOR PACKAGE / CASE:TO-3; THERMAL RESISTANCE:3.3C/W; EXTERNAL WIDTH:65MM; HEIGHT:20MM; HEATSINK MATERIAL:ALUMINIU

Unit Price9,05 EUR
Minimum Order Quantity1
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