FB2-233.4X220S Fotomechanix FB2-233.4X220S, Single Sided Photoresist Board FR4 35μm Copper Thick, 233.4 x 220 x 1.6mm

ProducentFotomechanix
Part Number

FB2-233.4X220S (FB22334X220S)

Specifications

FB2-233.4X220S, Single Sided Photoresist Board FR4 35μm Copper Thick, 233.4 x 220 x 1.6mm

Unit Price15,90 EUR
Minimum Order Quantity1
Tariff No.
Lead Time
Weight and Dimension
DescriptionBase MaterialEpoxy Glass Fabric Laminate Copper Thickness35µm Dimensions233.4 x 220 x 1.6mm FR Material GradeFR4 Length233.4mm Number of Sides1 Thickness1.6mm Width220mm Product Details FR4 Eurocard & Other Sizes FR4 substrates for normal applicationsBoard thickness 1.6 mmCopper thickness 35 μm Type Fotoboard FR4 Base Material Epoxy glass fabric laminate Foil Laminate High purity electro-deposited copper Dielectric Constant. 4.7 @ 1MHz Dissipation Factor 0.019 @ 1MHz Surface Resistance 4 x 1012Ω Volume Resistance 2 x 1015Ω cm Water Absorption >0.01% Solderbath Resistance Note Developer concentration: 25g/l of 690-849 or 6-10g/l of Sodium or Potassium Hydroxide. Conduct trials if in doubt. Approvals UL, CSA (K130 and above) Photoresists & Copper-Clad Boards Printed circuit board materials for the manufacture of high quality PCBsStandard high quality glass-epoxy FR4 substrate and glass-APPE substrate specifically for high frequency applicationsWhere applicable, the resist coated boards are exposed using UV light before being developed with half-strength Universal Developer solution and finally etched using a solution of Ferric Chloride Hexahydrate Crystals. Pre-sensitised with positive working photoresist, protected by a black plastic peel-off film Photoresists/Pre-sensitised Boards
Datasheets
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