FB2HF-100X160D Fotomechanix FB2HF-100X160D, Double Sided Photoresist Board FR4 35μm Copper Thick, 160 x 100 x 1.6mm
| |
|
| Producent | Fotomechanix | | Part Number | FB2HF-100X160D (FB2HF100X160D) |
| Specifications | FB2HF-100X160D, Double Sided Photoresist Board FR4 35μm Copper Thick, 160 x 100 x 1.6mm |
| Unit Price | 20,17 EUR |
| Minimum Order Quantity | 1 |
| Tariff No. | |
| Lead Time | |
| Weight and Dimension | |
| Description | Base MaterialEpoxy Glass Fabric Laminate Copper Thickness35µm Dimensions160 x 100 x 1.6mm FR Material GradeFR4 Length160mm Number of Sides2 Thickness1.6mm Width100mm Product Details Glass APPE High Frequency Glass-APPE substrate for high frequency and microwave useA faster photo-resist on Fotoboard 2 saves production time and costBoard size 100 x 160 x 1.6mmCopper thickness 35μm Type Fotoboard 2 HF Base Material APPE. Resin Bonded Glass Fabric Laminate Foil Laminate High Purity Electro-Deposited Copper Dielectric Constant. 3.8 - 4.0 @ 1Mhz Dissipation Factor 0.002 @ 1Mhz Surface Resistance - Volume Resistivity 1x 1013Ω cm Water Absorption >0.01% Solderbath Resistance Note Developer concentration: 25g/l of 690-849 or 6-10g/l of Sodium or Potassium Hydroxide. Conduct trials if in doubt. Approvals UL, CSA (K130 and above) Photoresists & Copper-Clad Boards Printed circuit board materials for the manufacture of high quality PCBsStandard high quality glass-epoxy FR4 substrate and glass-APPE substrate specifically for high frequency applicationsWhere applicable, the resist coated boards are exposed using UV light before being developed with half-strength Universal Developer solution and finally etched using a solution of Ferric Chloride Hexahydrate Crystals. Pre-sensitised with positive working photoresist, protected by a black plastic peel-off film Photoresists/Pre-sensitised Boards |
| Datasheets | |
E-shop Coming Soon
 | |
E-shop Coming Soon
| |
Related Parts
| |
|
