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| Producent | fuwang | | Part Number | HFI005 (HFI005) |
| Specifications | FR-4 Printed Circuit Board for LED electronic products |
| Unit Price | 0,47 EUR |
| Minimum Order Quantity | 1 |
| Tariff No. | |
| Lead Time | |
| Weight and Dimension | |
| Description | Place of Origin: Hainan, China (Mainland) Brand Name: fuwang Model Number: HFI005 Base Material: FR-4,CEM-1,CEM-3,Hight TG,ect Copper Thickness: 0.5-4.0oz Board Thickness: 0.3-3.2mm Min. Hole Size: 0.15mm Min. Line Width: 0.075mm(3mil) Min. Line Spacing: 0.075mm(3mil) Surface Finishing: Immersion Gold/Au, HASL, OSP Solder mask: green/black/white/red/blue/yellow PCB Tolerance of finished thickness: ±5% Hole tolerance: PTH:±0.075,NTPH:±0.05 Max board size: 1200mm*600mm profiling punching: Routing, V-CUT, Beveling Wrap and twist: 5% Packaging & Delivery Packaging Details: Each pieces of PCBA in plastic ESD bags , Then PCBAs in small Carton,4 small cartons in one Large Carton.Large CTN Dimension:35CM*32CM*40CM Delivery Detail: 5-20 days after received customers' deposit Specifications PCB Board for electronic products 1.Free Test& Free programmer 2.customs circuit board 3.pcb design & manufacture FR-4 Printed Circuit Board for LED electronic products 1.Specification: 1Layer1-30 layer2MaterialFR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum3Board thickness0.2mm-7mm4Max.finished board side500mm*500mm5Min.drilled hole size0.25mm6Min.line width0.075mm(3mil)7Min.line spaceing0.075mm(3mil)8Surface finish/treatmentHALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating9Copper thickness0.5-4.0oz10Solder mask colorgreen/black/white/red/blue/yellow11Inner packingVacuum packing,Plastic bag12Outer packingStandard carton packing13Hole tolerancePTH:±0.076,NTPH:±0.0514CertificateUL,ISO9001,ISO14001,ROHS,CQC15Profiling PunchingRouting,V-CUT,Beveling16Assembly ServiceProviding OEM service to all sorts of printed circuit board assembly 2. Technical requirement: 1) Professional Surface-mounting and Through-hole soldering Technology2) Various sizes like 1206,0805,0603 components SMT technology3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.4) PCB Assembly With UL,CE,FCC,Rohs Approval5) Nitrogen gas reflow soldering technology for SMT.6) High Standard SMT&Solder Assembly Line7) High density interconnected board placement technology capacity. |
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