KA1502AC30X30 Laird Technologies THERMALLY CONDUCTIVE CHIP PAD; THICKNESS:0.16MM; THERMAL IMPEDANCE:0.49 C/W; LENGTH:30MM; MATERIAL:ALUMINUM; OVERALL WIDTH:30MM; THERMAL RESISTANCE:2.
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| Producent | Laird Technologies | | Part Number | KA1502AC30X30 (KA1502AC30X30) |
| Specifications | THERMALLY CONDUCTIVE CHIP PAD; THICKNESS:0.16MM; THERMAL IMPEDANCE:0.49 C/W; LENGTH:30MM; MATERIAL:ALUMINUM; OVERALL WIDTH:30MM; THERMAL RESISTANCE:2. |
| Unit Price | 40,77 EUR |
| Minimum Order Quantity | 1 |
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