DS34S132GN+ Maxim Integrated Products IC TDM OVER PACKET 676-BGA Telecom IC TDM-over-Packet (TDMoP) 676-PBGA (27x27)

ProducentMaxim Integrated Products
Part Number

DS34S132GN+ (DS34S132GN)

Specifications

IC TDM OVER PACKET 676-BGA Telecom IC TDM-over-Packet (TDMoP) 676-PBGA (27x27)

Unit Price235,91 EUR
Minimum Order Quantity1
Tariff No.
Lead Time42 weeks
Weight and Dimension
DescriptionCategories Integrated Circuits (ICs) Interface - Telecom Manufacturer Maxim Integrated Series - Packaging Tray Part Status Active Function TDM-over-Packet (TDMoP) Interface TDMoP Number of Circuits 1 Voltage - Supply 1.8V, 3.3V Current - Supply - Power (Watts) - Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 676-BGA Supplier Device Package 676-PBGA (27x27) Includes -
Datasheets
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