CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - POT DE 500G MBO MBO Paste Solder, +217 → +219°C Melting Point, 0.5% Copper, 96.5% Tin, 3% Silver, 500g

ProducentMBO
Part Number

CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - POT DE 500G (CREGRAVEMESN965AG3CU05SIRIUS1LFPOTDE500G)

Specifications

MBO Paste Solder, +217 → +219°C Melting Point, 0.5% Copper, 96.5% Tin, 3% Silver, 500g

Unit Price128,38 EUR
Minimum Order Quantity1
Tariff No.
Lead Time
Weight and Dimension
DescriptionFlux TypeResin Melting Point+217 → +219 Percent Copper0.5% Percent Silver3% Percent Tin96.5% Product FormPaste Product Weight500g Product Details Sirius 1 LF solder paste Sn96.5 Ag3 Cu0.5 No-Clean solder paste suitable for stencil printing for reflow processes.Fine pitch capability (400 μm).High activity.Minimal residue, neutral and colourless.Chlorine-free. Solder Paste - Lead Free
Datasheets
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