322-HCS5P3-300 Te Connectivity Socket IC DIP 2.54mm Holtite

ProducentTe Connectivity
Part Number

322-HCS5P3-300 (322HCS5P3300)

Specifications

Socket IC DIP 2.54mm Holtite

Unit Price0,12 EUR
Minimum Order Quantity1
Tariff No.
Lead Time
Weight and Dimension
DescriptionBody OrientationStraight Contact MaterialBeryllium Copper Contact PlatingTin Current Rating5A GenderFemale Number of Contacts1 Number of Rows1 Pitch2.54mm Termination MethodSolder Product Details TE Connectivity HOLTITE® Series Discrete Sockets HOLTITE® Series discrete socket contacts with a solderless zero profile for inserting into plated thru-holes on a PCB board enabling the holes to become the component socket. These HOLTITE® discrete socket contacts are conical in shape and re-size the thru-hole on the board when pressed into place. For dimensions and plating options please see additional data table.Stock numbers 718-5189 and 745-5044 are discrete sockets in a mylar film carrier with a 2.54mm centre line and 7.62mm row to row spacing. Additional Data Table RS Stock Number Manufacturer Part Number Socket Length Hole Size Mating Pin Diameter Socket Plating 680-1843 6-1437514-6 2.39mm 1.04mm 0.41 - 0.53mm Gold plated beryllium copper 718-5287 6-1437514-7 2.39mm 1.04mm 0.41 - 0.53mm Tin lead plated beryllium copper 718-5280 1-1437514-3 2.54mm 1.12mm 0.76mm Gold plated beryllium copper 680-5117 2-1437506-4 3.45mm 1.47mm 0.51 - 0.76mm Gold plated beryllium copper 821-8868 6-1437514-8 3.45mm 1.47mm 0.51 - 0.76mm Gold plated beryllium copper 680-5126 2-1437506-7 3.45mm 1.47mm 0.64 - 0.89mm Gold plated beryllium copper 718-5284 8134-HC-8P2 3.45mm 1.47mm 0.64 - 0.89mm Gold plated beryllium copper TE Connectivity Discrete PCB Connections
Datasheets
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